David Farren, Plus Group Packaging Solutions Engineering Specialist
David is a Packaging Engineering Specialist with Plus Group. David has his BS in Mechanical Engineering from the University of Dayton. He has over 30 years experience providing leadership, supervision, & technical direction for multidiscipline teams to deliver new products to market from feasibility, to pilot production, to full scale commercialization.
David’s experience includes reliability improvement projects, reduction in changeover times, increased productivity and sustainability among other successes. He has substantial experience in packaging & batch process equipment applications, pouch form fill, web handling, die punching, laser imprinting and sealing technologies (hot air, ultrasonic, convective, & conductive methods). Read about Plus Group’s packaging services here.
David focuses on the implementation of innovative technologies that provide competitive advantage through unique manufacturing capabilities & superior system reliability. He has proven success in the chemical and consumer products industries and has the ability to fulfill multiple roles.
Interesting fact: David is an Avid Road Bicyclist. He logged 3885 miles from July 2018 – June 2019.